Products
Products
MKW-2218K型多线数控切割机主要适用于磁性材料、半导体材料、 宝石、陶瓷、各种玻璃等硬脆材料的精密切割。
MKW-2218K multi-wire cutter of digital control （saw） is mainly used for precision cutting of hard and brittle materials such as magnetic material, semiconducting material, jewel, ceramics, various glasses etc.
| 名称 | NAME | MKW 2218K |
| 工作平面 | Workplace | 220*180mm |
| 工作台最小步进 | Min remove of workplace | 0.01mm |
| 最小切片厚度 | Min thickness of wafer | 0.2mm |
| 平行度 | Parallelism | ≤4um |
| 整板厚度偏差 | Thickness warp of the plank | ≤ 20um |
| 切片粗糙度 | The surface roughness | 0.4 |
| 切片尺寸（长*宽*高) | Wafer dimension (L*W*H) | 220*180*180(mm) |
| 可用切割线直径 | The diameter of incisory line | C 0.1-c 0.25 |
| 工作速度 | Work speed | 280m/min |
| 工作台旋转角度 | Rotary angle of workplace | 0-±7.5° |
| 最大速度 | Max speed | 300m/min |
| 工作台移动速度 | The move speed of workplace | 0.1-1800mm/h |
| 供线轮贮线里 | About 65km | |
| 电源 | Power supply | 3p 220V |
| 整机能耗 | Machine power | 6KW |
| 外形尺寸 | Out line dimension(L*W*H) | 1900*2300*2200(mm) |
| 机器重量 | The weight of machine | 4800kg |
注：技术不断进步，参数茗有变动，恕不另行遇知。
The specification are subject to change without notice
